Russia uses electronic components manufactured in the United States, Switzerland, Germany and Japan to produce missiles, but the United States accounts for 81% of such microelectronics.
Source: a new document of the Yermak-McFaul sanctions group, which was obtained by LIGA.net
Details: According to the Yermak-McFaul group, the Kh-101 air-launched cruise missiles contain at least 53 types of electronic components (microchips, chips, etc.) manufactured by foreign companies.
In particular, these are components of such companies as STMicroelectronics (Switzerland), Vicor (USA), XILINX (USA), Intel Corporation (USA), Texas Instruments (USA), ZILOG (USA), Maxim Integrated (USA) and Cypress Semiconductor (USA).
At least 45 types of foreign-made electronic components are used to produce 3M-14 Kalibr sea-launched cruise missiles.
9M723 ballistic missiles and 9M728/9M729 cruise missiles from the Iskander systems are equipped with at least 15 and 32 types of foreign electronic components, respectively.
As part of the Kh-47M2 Kinzhal air-launched ballistic missiles, at least 48 foreign components are used.
And in the Russian Tornado-S rocket, particularly in the warhead, a chip manufactured by the world-famous American company Intel was found.
Most of Russia's foreign electronic component base for missile production is made in the United States (81%).
The second-largest share after the United States is in electronic components manufactured in Switzerland (8%). Germany and Japan each have 3.5%.
Earlier, Andrii Yermak, the Head of the Office of the President, reported that about 50 components in the Kh-101 missile, which was used by the Russians to attack a residential building in Kryvyi Rih on 13 June, and was made in Russia in April 2023, are mainly microelectronics produced in the countries of the free world and delivered to the Russian Federation in various ways.